Sun Microsystems, Inc.   Sun System Handbook - ISO 3.4 June 2011 Internal/Partner Edition
   Home | Current Systems | Former STK Products | EOL Systems | Components | General Info | Search | Feedback

Sun SPARC[tm] Enterprise T5240 Server: Hardware Specifications

Processor
Number Two UltraSPARC T2 Plus multicore processors
Architecture SPARC V9 architecture, ECC protected
CPUs 1.2GHz 4-Core (32 ×2 for a total of 64 concurrent threads)
1.2GHz 6-Core (48 ×2 for a total of 96 concurrent threads)
1.2GHz 8-Core (64 ×2 for a total of 128 concurrent threads)
1.4GHz 8-Core (64 ×2 for a total of 128 concurrent threads)
Cache memory 4MB Level 2
Main Memory
Capacities Total DIMM slots: 16 on system board, 16 on memory mezzanine, 32 slots total
DIMM type: FBDIMM
DIMM size: 1GB, 2GB, 4GB or 8GB
Maximum capacity: 256GB (32 × 8GB)
Standard Integrated Interfaces
Network 4 × 10/100/1000 Mbps autonegotiating ports
Note: 10-Gb Ethernet ports are available by adding XAUI cards to the I/O expansion slots. For each XAUI card added, one onboard 1Gb ethernet port is disabled.
Network Management One dedicated 10/100Base-T RJ-45 port Ethernet port
Serial Management One dedicated RJ-45 port
Remote Management Onboard system controller, running Integrated Lights Out Manager (ILOM) 2.0 with two command sets:
  • ILOM
  • ALOM CMT compatibility shell
Both command sets are available through the RJ-45 serial and 10/100Mbps ethernet interfaces.
Serial One DB-9 connector
USB Front: 2 USB 2.0 Ports
Rear: 2 USB 2.0 Ports
PCI Expansion Slots
  • 6 low-profile PCI-Express slots.
  • Slots 0 and 1 support PCI-Express or proprietary 10Gbit Ethernet (XAUI) cards.
Slot # Physical Electrical
0 x8 x8
1 x8 x8
2 x16 x8
3 x8 x8
4 x8 x8
5 x8 x8
Internal Mass Storage
Disks
  • All PTO standard configurations ship with 8 disk backplanes and cannot be changed later.
  • ATO configurations provide an 8 disk or 16 disk backplane option as a selectable item.
  • The maximum disk capacity depends on which backplane is selected, and cannot be changed later.
    • Up to 16 73GB (10K or 15K RPM), 146GB 10K RPM, and 300GB, 10K RPM SAS 2.5 inch form factor disk drives

Notes:
Integrated hard drive controller supports RAID 0 and RAID 1.
Hard drive configurations of nine or more hard drives require an input voltage of 200 - 240VAC.
Solid State Drives
  • Up to 8 32GB solid state drives
DVD-ROM 1 slimline DVD-Writer/CD-Writer
Power Supplies
2 × 1100 Watt, hot-swappable, N+1 redundant power supply units (PSU)
Environment
Input Voltage 100 - 240 VAC, 50-60Hz
200 - 240 VAC, 50-60Hz for configurations containing either 16-disk backplane or 1.4GHz CPUs
Input Current 12.0 - 10.0 A @ 100-120 VAC (max)
7.2 - 6.0 A @ 200-240 VAC (max)
Note: The maximum operating input values are based on P / (V *0.95), where P=maximum input power, V=input voltage. You can use this equation to calculate the maximum operating input current for your specific input voltage.
Input Power 1364 W (max)
Heat Output 4653 BTU/hr (max)
Temperature

Operating: 5° C to 35° C (41° F to 95° F)
Nonoperating: -40° C to 65° C (-40° F to 149° F)

Note: Above 900m (3000 ft), decrease maximum temperature as altitude increase, 1° C/300m (1.6° F/1000ft)

Humidity Operating: 10% to 90% relative humidity noncondensing, 27° C (80.6° F) maximum wet bulb
Nonoperating: 93% relative humidity noncondensing, 35° C (95° F) maximum wet bulb
Altitude Operating: up to 3000m (10000 ft.)
Nonoperating: up to 12000m (40000 ft.)
Vibration Operating: 0.15G (z-axis), 0.10G (x,y axes) 5-500Hz swept sine
Nonoperating: 0.5G (z-axis), 0.25G (x,y axes) 5-500Hz swept sine
Shock Operating: 3G, 11ms half-sine
Nonoperating: 1-inch roll-off free fall, front-to-back rolling direction, 25mm threshold height at 0.75 m/s impact velocity
Sound Power Level
LwAd (1 B = 10dB)
Operating: 7.7 B
Idling: 7.7 B
Sound Pressure Level
LpAm (bystander positions)
Operating: 66 dB
Idling: 66 dB
Regulations
Meets or exceeds the following requirements:
RoHS Compliance Level RoHS:Y
Safety UL/CSA-60950-1, EN60950-1, IEC60950-1 CB Scheme with all country deviations, IEC825-1, 2, CFR21 part 1040, CNS14336, GB4943
RFI/EMI EN55022 Class A 47 CFR 15B Class A ICES-003 Class A VCCI Class A AS/NZ 3548 Class A CNS 13438 Class A KSC 5858 Class A GB9254 Class A EN61000-3-2 GB17625.1 EN61000-3-3
Immunity EN55024 IEC 61000-4-2 IEC 61000-4-3 IEC 61000-4-4 IEC 61000-4-5 IEC 61000-4-6 IEC 61000-4-8 IEC 61000-4-11
Regulatory Markings CE, FCC, ICES-003, C-tick, VCCI, GOST-R, BSMI, MIC, UL/cUL, UL/LVD, UL/S-mark
Dimensions and Weight
Height 88 mm (3.49 in.)
Width 425 mm (16.75 in.)
Depth 714 mm (28.1 in.)
Weight 23.81 kg (52.5 lb.) *
* - Memory mezzanine assembly adds about 1.36 kg (3 lbs.)
Clearance and Service Access
Front 910 mm (36 in.)
Rear 910 mm (36 in.)
Rack Mounting

  Copyright � 2011 Sun Microsystems, Inc.  All rights reserved.
 Feedback