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Asset ID: 1-72-1371320.1
Update Date:2011-10-27
Keywords:

Solution Type  Problem Resolution Sure

Solution  1371320.1 :   VSM - IBM z/OS 1.12 and 1.13 May Cause FSC3BC8 Warm Boots Under High Workload  


Related Items
  • Sun StorageTek VSM System
  •  
Related Categories
  • PLA-Support>Sun Systems>TAPE>Virtual Tape>SN-TP: VTL
  •  
  • PLA-Support>Sun Systems>TAPE>Virtual Tape>SN-TP: VSM
  •  




In this Document
  Symptoms
  Changes
  Cause
  Solution


Applies to:

Sun StorageTek VSM System - Version: 4 to 5C - Release: 4.0 to 5.0
Information in this document applies to any platform.

Symptoms

The VSM may experience FSC3BC8 warm boots. In certain situations under a heavy load, the potential for data integrity issues could exist.

Changes

Upgraded to IBM z/OS 1.12 or 1.13

Cause

In IBM release z/OS 1.12 the default block size for SAP pack dump tape records was increased to large block sizes (greater than 200K). This block size is more efficient when using physical tape drives but is less efficient when using virtual architectures.

On the StorageTek VSM product when the large block sizes are used in conjunction with very high combined workloads (front-end, back-end, staging and VTV deletes) it can expose a microcode deficiency in the VSM product. This problem is present in all microcode levels available today for the VSM product.

In IBM release z/OS 1.13 there may be some applications which use large block sizes for tape (real and virtual) and that do not allow the user to control or modify the default block size. Please note that as of the writing of this document Oracle has not yet announced official support of this OS.

Solution

Workaround:
The large block size default setting in z/OS 1.12 should be overridden when writing to a VSM product. It is recommended that a block size of 65520 (64K) be used to avoid this problem.

Fix:
A fix for this problem is currently in development. It is scheduled for availability as a team-build ZD2.12.XX.00 code on 11/15/2011. The fix will also be included in the next GA release of microcode D02.14.XX.00 scheduled for 11/30/2011.



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