Sun Microsystems, Inc.   Sun System Handbook - ISO 4.1 October 2012 Internal/Partner Edition
   Home | Current Systems | Former STK Products | EOL Systems | Components | General Info | Search | Feedback

Netra[tm] T4-1 Server: Hardware Specifications

Processor
Number One 4-Core SPARC T4 2.85GHz
or
One 8-Core SPARC T4 2.85GHz
Architecture SPARC V9 architecture, ECC protected
CPUs
  • 2.85GHz 4-core or 8-core SPARC T4
  • 4-core 32 threads
  • 8-core 64 threads
  • up to 8 floating-point units
  • On-chip encryption instruction accelerators with direct non-privileged support for 16 industry standard cryptographic algorithms plus random number generation in each of the 8-cores: AES, Camellia, CRC32c, DES, 3DES, DH, DSA, ECC, Kasumi, MD5, RSA, SHA-1, SHA-224, SHA-256, SHA-384, SHA-512
Cache memory
  • Level 1: 16KB instruction cache and 16K data cache per core
  • Level 2: 128KB cache per core
  • Level 3: Shared 4MB cache
Main Memory
Capacities
  • Total DIMM slots: 16 on system board
  • DIMM type: DDR3
  • DIMM size: 4GB, 8GB, and 16GB
  • Maximum capacity: 256GB (16 × 16GB)
Standard Integrated Interfaces
Network 4 × 10/100/1000 Mbps auto negotiating ports
Up to 2 optional 10 GbE XAUI connections
Network Management One dedicated 10/100Base-T RJ-45 port Ethernet port
Serial Management One dedicated RJ-45 port
Remote Management Onboard system processor, running Integrated Lights Out Manager (ILOM)
Graphics One HD-15 VGA connector
USB Front: 2 USB 2.0 Ports
Rear: 2 USB 2.0 Ports
PCI Expansion Slots
  • Five PCIe Gen2 x8 slots (including support of two full height half length PCIe cards slots and three low profile cards slots or two XAUI)
  • Slots 0 and 1 support PCI-Express or XAUI cards.
Slot # Physical Electrical
0 x8 x8
1 x8 x8
2 x8 x8
3 x16 x8
4 x16 x8
Internal Mass Storage
Disks
  • Up to four 2.5-inch SAS-2 disk drives
  • 300GB or 600GB 2.5-inch SAS disk drives
  • RAID 0 and RAID 1 support
DVD-ROM 1 slimline SATA DVD Drive
Power Supplies
2 × 1200 Watt (Type A249A AC or Type D204A DC), hot-swappable, N+1 redundant power supply units (PSU)
Environment
Input Voltage (AC) 100 - 240 VAC, 50-60Hz
(DC) -48 VDC or -60 VDC
Temperature

Operating: 5° C to 45° C (41° F to 113° F)
Short Term Operating: -5° C to 55° C (23° F to 131° F)
Nonoperating: -40° C to 70° C (-40° F to 158° F)

Humidity Operating: 5% to 85% relative humidity noncondensing
Short Term Operating: 5% to 90% relative humidity noncondensing, but not to exceed 0.024 kg water/kg dry air (0.053 lb. water/2.205 lbs. dry air)
Nonoperating: 93% relative humidity noncondensing, 40° C, 104° F) maximum wet bulb
Altitude Operating: Meeets NEBS 4000m (13,123 ft) requirement
Nonoperating: up to 12000m (39,370 ft.)
Seismic GR-63-CORE requirements for Earthquake Zone 4
Acoustic Noise Operating/Idling: 7.2 B (LwAd, 1B = 10dB)
NEBS NEBS Level3 certified by Telecordia
Regulations
Meets or exceeds the following requirements:
Safety UL/CSA C22.2 60950-1, 2nd Edition EN 60950-1, 2nd Edition, IEC 60950-1 :2005 2nd Edition CB Scheme with all national differences, IEC 825-1,2 and CFR21 part 1040
RFI/EMI EN55022:2006+A1:2007/CISPR22:2005+A1:2005+A2:2006 EN300 386 V1.4.1 Class A, FCC CFR 47 Part 15 Class A
Immunity EN55024/CISPR 24, EN 61000-3-2, EN 61000-3-3
Regulatory Markings CE, FCC, ICES-003, C-tick, VCCI, GOST-R, BSMI, MIC, UL/cUL, S-mark, CCC
Other Restriction of Hazardous Substances (RoHS) labeled, per WEEE (Waste Electrical and Electronics Equipment) Directive (2002/95/EC)
Telecommunications EN 300 386
Dimensions and Weight
Height 87.1 mm (3.43 in.)
Width 445 mm (17.52 in.) including bezel
Depth 526 mm (20.71 in.) max to PSU handles
Depth 501 mm (19.72 in.) max to rear I/O
Weight 18.6kg (41 lbs) - fully configured without PCI cards installed

  Copyright � 2012 Sun Microsystems, Inc.  All rights reserved.
 Feedback