Document Audience: | INTERNAL |
Document ID: | I0974-1 |
Title: | A specific group of Sun Fire V1280 systems may exhibit a mechanical fit issue which interferes with insertion or removal of System Board 0. |
Copyright Notice: | Copyright © 2005 Sun Microsystems, Inc. All Rights Reserved |
Update Date: | 2004-06-02 |
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- Sun Proprietary/Confidential: Internal Use Only -
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FIELD INFORMATION NOTICE
(For Authorized Distribution by SunService)
FIN #: I0974-1
Synopsis: A specific group of Sun Fire V1280 systems may exhibit a mechanical fit issue which interferes with insertion or removal of System Board 0.Create Date: May/09/03
SunAlert: No
Top FIN/FCO Report: No
Products Reference: Sun Fire V1280 Servers
Product Category: Server / Service
Product Affected:
Systems Affected:
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Mkt_ID Platform Model Description Serial Number
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- A40 ALL Sun Fire V1280 -
PRODUCTS AFFECTED:
Mkt_ID Platform Model Description Serial Number
------ -------- ----- ----------- -------------
- - - - -
Parts Affected:
Part Number Description Model
----------- ----------- -----
- - -
References:
ECO: WO_25582
Manual: 817-0510-10: Sun Fire V1280/Netra 1280 Service Manual.
Issue Description:
Early shipments of Sun Fire V1280 systems may experience a mechanical
fit issue which prevents System Board 0 (SB0) from being easily
inserted into or removed from the chassis. A plunger assembly in the
chassis may interfere with this System Board as it is slid into or out
of the chassis. This could cause connector pin damage, poor
connectivity, or possible contamination of SB0.
This issue can occur in a group of approximately 50 V1280 systems which
shipped in December of 2002. This group includes Sun internal support
systems as well as some customer systems.
On early shipments, the product chassis was supplied with a mechanical
plunger assembly that was specifically fitted to assist in the location
of the baseplane assembly. During system assembly and test, it was
found that this mechanical plunger assembly could rub/interfere with
the edges of the SB0 module, preventing easy insertion of the module.
Note that SB0 is the CPU/Memory Uniboard positioned at the middle of
the chassis next to the Level 2 Repeater Boards.
This occurs because the mechanical plunger is fitted too close to the
guide rails of SB0. During insertion, the board green plastic hold
grip catches onto the plunger and sheds particles of plastic around the
baseplane and onto the connectors.
This issue has been addressed in Sun Manufacturing by ECO W0_25582.
It has been determined that this plunger is not needed, and therefore
corrective action was put in place in Manufacturing by removing the
plunger from new builds via ECO W0_25582 beginning January 2003.
This change did not affect any Field Replaceable Units.
If this issue is encountered on any of the systems which were part of
the earlier shipments, please follow the corrective procedure described
below.
Implementation:
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| | MANDATORY (Fully Proactive)
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---
| | CONTROLLED PROACTIVE (per Sun Geo Plan)
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| X | REACTIVE (As Required)
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Corrective Action:
The following recommendation is provided as a guideline for authorized
Sun Services Field Representatives who may encounter the above
mentioned problem.
If this issue is encountered in a Sun Fire V1280 system, remove the
plunger assembly from the chassis. Removal of this plunger assembly
will involve system downtime and removal of multiple FRUs. The
estimated time to carry out this action is 45 minutes.
Plunger Location: Viewed from the front, looking down into the chassis
with the CPU/Memory board in slot 0 removed, the plastic guiderail for
the CPU/Memory board is visible to the right of the plunger.
Plunger Removal Instructions: Refer to the Sun Fire V1280/Netra 1280
Service Manual (817-0510-10)
1. Power off the system and remove the input power connector(s)
and all connectors from the rear of the system.
2. With the rack stabilizer feet extended slide the system out of the
rack.
3. Remove the CPU/Memory Board in slot 0 and place it on a grounded
ESD mat.
4. Remove the CPU/Memory Board in slot 2 and place it on a grounded
ESD mat (if applicable), or remove filler panel.
5. Unlatch and unplug the main fan tray power connector.
6. Remove the the system indicator board connector retaining clip and
unplug the connector.
7. Remove the main fan tray assembly.
8. Disengage and raise the CPU/Memory board (slot 4, if applicable)
and both L2 Repeater boards.
9. Disconnect the cables from the IB_SSC assembly to the removable
media modules and secure them out of the way.
10. Remove the IB_SSC board and place it on a grounded ESD mat.
11. Disengage the power supply module(s)
12. Remove the Power Distribution board and place it on a grounded
ESD mat.
13. Loosen completely the 31 screws securing the baseplane to the
chassis.
14. Remove the Baseplane and place it on a grounded ESD mat.
15. Locate the plunger sleeve on the outside of the chassis. The
sleeve has two flattened edges to grip. Using pliers, unscrew the
sleeve from the plunger and remove the plunger from within the
chassis.
16. Reinstall all components.
Comments:
None
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Implementation Footnote:
i) In case of MANDATORY FINs, Sun Services will attempt to contact
all affected customers to recommend implementation of the FIN.
ii) For CONTROLLED PROACTIVE FINs, Sun Services mission critical
support teams will recommend implementation of the FIN (to their
respective accounts), at the convenience of the customer.
iii) For REACTIVE FINs, Sun Services will implement the FIN as the
need arises.
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