Document Audience: | INTERNAL |
Document ID: | I0683-1 |
Title: | Heat sink fall off problem on Sunfire CPU & I/O boards |
Copyright Notice: | Copyright © 2005 Sun Microsystems, Inc. All Rights Reserved |
Update Date: | 2001-07-24 |
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- Sun Proprietary/Confidential: Internal Use Only -
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FIELD INFORMATION NOTICE
(For Authorized Distribution by SunService)
FIN #: I0683-1
Synopsis: Heat sink fall off problem on Sunfire CPU & I/O boardsCreate Date: Jun/14/01
Keywords:
Heat sink fall off problem on Sunfire CPU & I/O boards
SunAlert: No
Top FIN/FCO Report: No
Products Reference: Clip-on Heat Sinks on I/O boards
Product Category: Server / Service
Product Affected:
Mkt_ID Platform Model Description Serial Number
------ -------- ----- ----------- -------------
Systems Affected
----------------
- E3000 ALL Ultra Enterprise 3000 -
- E3500 ALL Ultra Enterprise 3500 -
- E4000 ALL Ultra Enterprise 4000 -
- E4500 ALL Ultra Enterprise 4500 -
- E5000 ALL Ultra Enterprise 5000 -
- E6000 ALL Ultra Enterprise 6000 -
- E5500 ALL Ultra Enterprise 5500 -
- E6500 ALL Ultra Enterprise 6500 -
X-Options Affected
------------------
X2602A - - OPT INT CPU/MEM BD FOR EXX00 -
X2612A - - OPT INT I/O BD EXX00 W/FC-AL -
X2622A - - OPT INT GRAPHICS I/O BD EXX00 -
Parts Affected:
Part Number Description Model
----------- ----------- -----
501-4881-02 ASSY,I/O BD,PCI,SUNFIRE+ -
501-4882-01 ASSY, TSTD, CPU BD, SUNFIRE+ -
501-4883-03 ASSY,TSTD,IO BD,SOC+,SUNFIRE+ -
501-4884-03 ASSY,TSTD,IOG,SOC+,SUNFIRE+ -
501-4926-02 ASSY,PCI IO SNFR+ W/5V RISER -
References:
ECO: WO_15381
LEAP: 1051
MANUAL: 805-2632-10: Sun Enterprise 6500/5500/4500 Systems Reference Manual.
Issue Description:
The clip-on heat sinks found on older style Sunfire CPU and I/O boards
have been found to be unreliable. These heat sinks may fall off due to
system vibration or other unknown causes. This may lead to component
overheating or failure and can cause system downtime. CPU boards and
I/O boards for Enterprise E3X00, E4X00, E5X00, and E6X00 systems are
affected.
These older style heat sinks, which sit on top of the power chips
located along the connector edge of the board, use metal clips to
attach the heat sink to the chip. This design was found to be
unreliable and the clips would sometimes come loose due to fan
vibration, causing the heat sinks to detach from the chip.
The previous advice via FIN I0282-1 to Field Support was to repair
these heat sinks in the field by simply reattaching the heat sinks.
There was no better solution from Engineering at that time. There is
now a new recommendation to replace the defective board with a
replacement board containing an improved heat sink design.
ECO WO_15381 was released in August of 1999 to add adhesive heat sinks
to system and I/O boards. This new design prevents the heat sinks from
coming loose.
If loose or detached heat sinks are encountered in the field, the
affected board should be returned for repair through normal channels.
No attempt should be made to repair the problem on-site.
Implementation:
---
| | MANDATORY (Fully Pro-Active)
---
---
| | CONTROLLED PRO-ACTIVE (per Sun Geo Plan)
---
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| X | REACTIVE (As Required)
---
Corrective Action:
The following recommendation is provided as a guideline for authorized
Enterprise Services Field Representatives who may encounter the above
mentioned problem.
NOTE: These procedures should only be followed when a CPU or I/O board
has experienced a failure (heat sink has fallen off) and requires
replacement. This FIN does not recommend or authorize proactive
replacement of these FRUs.
Follow these guidelines if this problem is encountered:
. Any boards with heat sinks that have fallen off should not be repaired
in the field, as this is not an effective repair method.
. The affected system boards along with the heat sinks must be returned
to the local Enterprise Services Logistics Depot as defected.
. Replace the defective board with a board which has the adhesive glue
on the heat sink per ECO WO_15381. These current FRU's have the ECO
implemented and should be used as replacement parts:
F501-4881-03 ASSY,I/O BD,PCI,SUNFIRE+
F501-4882-02 FRU,ASSY,TSTD,CPU BD,SUNFIRE+
F501-4883-04 FRU,ASSY,IO BD,SOC+,SUNFIRE+
F501-4884-04 FRU,ASSY,IOG,SOC+,SUNFIRE+
F501-4926-03 FRU,ASY,PCI IO SNFR+ W/5V RISER
Replacement procedures for these boards can be found in Chapters 3
and 4 of the Sun Enterprise 6500/5500/4500 Systems Reference Manual.
Please be aware of the board handling procedures relating to heat
sinks which are described on pages 3-2 and 4-2.
Comments:
None
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Implementation Footnote:
i) In case of MANDATORY FINs, Enterprise Services will attempt to
contact all affected customers to recommend implementation of
the FIN.
ii) For CONTROLLED PROACTIVE FINs, Enterprise Services mission critical
support teams will recommend implementation of the FIN (to their
respective accounts), at the convenience of the customer.
iii) For REACTIVE FINs, Enterprise Services will implement the FIN as the
need arises.
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All released FINs and FCOs can be accessed using your favorite network
browser as follows:
SunWeb Access:
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* Access the top level URL of http://sdpsweb.ebay/FIN_FCO/
* From there, select the appropriate link to query or browse the FIN and
FCO Homepage collections.
SunSolve Online Access:
-----------------------
* Access the SunSolve Online URL at http://sunsolve.Corp/
* From there, select the appropriate link to browse the FIN or FCO index.
Supporting Documents:
---------------------
* Supporting documents for FIN/FCOs can be found on Edist. Edist can be
accessed internally at the following URL: http://edist.corp/.
* From there, follow the hyperlink path of "Enterprise Services Documenta-
tion" and click on "FIN & FCO attachments", then choose the appropriate
folder, FIN or FCO. This will display supporting directories/files for
FINs or FCOs.
Internet Access:
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* Access the top level URL of https://infoserver.Sun.COM
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General:
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* Send questions or comments to [email protected]
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