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Document ID: | I0403-2 |
Title: | UPDATED FIN. EXX00 and E10000 CPU Module Handling and Torque Sequence, E10000 I/O Mezzanine and E10000 Memory Mezzanine Torque Sequence |
Copyright Notice: | Copyright © 2005 Sun Microsystems, Inc. All Rights Reserved |
Last Updated Date: | 1998-12-24 |
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- Sun Proprietary/Confidential: Internal Use Only -
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FIELD INFORMATION NOTICE
(For Authorized Distribution by SunService)
FIN #: I0403-2
Synopsis: UPDATED FIN. EXX00 and E10000 CPU Module Handling and Torque Sequence, E10000 I/O Mezzanine and E10000 Memory Mezzanine Torque SequenceCreate Date: Dec/23/98
Keywords:
UPDATED FIN. EXX00 and E10000 CPU Module Handling and Torque Sequence, E10000 I/O Mezzanine and E10000 Memory Mezzanine Torque Sequence
Top FIN/FCO Report: Yes
Products Reference: EXX00/E10000 CPU Torque Sequence
Product Category: Server / System CPU Module / Service
Product Affected:
Mkt_ID Platform Model Description Serial Number
------ -------- ----- ----------- -------------
Systems Affected
----------------
- E10000 All Ultra Enterprise 10000 -
- E6500 All Ultra Enterprise 6500 -
- E6000 All Ultra Enterprise 6000 -
- E5500 All Ultra Enterprise 5500 -
- E5000 All Ultra Enterprise 5000 -
- E4500 All Ultra Enterprise 4500 -
- E4000 All Ultra Enterprise 4000 -
- E3500 All Ultra Enterprise 3500 -
- E3000 All Ultra Enterprise 3000 -
X-Options Affected
------------------
X2560A - - 336MHz UltraSPARC II Module 4MB Cache -
X2550A - - 250MHz UltraSPARC II Module 4MB Cache -
X2530A - - 250MHz UltraSPARC II Module 1MB Cache -
X2510A - - 167MHz UltraSPARC II Module 1MB Cache -
X2500A - - 167MHz UltraSPARC II Module .5MB Cache -
Parts Affected:
Part Number Description Model
----------- ----------- -----
501-2941-0X 167 MHz UltraSPARC II Module .5MB Cache -
501-2959-0X 167 MHz UltraSPARC II Module 1MB Cache -
501-4178-0X 250 MHz UltraSPARC II Module 1MB Cache -
501-4249-0X 250 MHz UltraSPARC II Module 4MB Cache -
501-4836-0X 250 MHz UltraSPARC II Module 4MB Cache -
501-4363-0X 336 MHz UltraSPARC II Module 4MB Cache -
501-4349-0X SBus I/O Board -
501-4478-0X SBus I/O Board -
501-4779-0X PCI I/O Board -
501-4351-0X E10000 Memory Module -
501-4776-0X E10000 Memory Module -
REFERENCES:
MANUAL: 805-4500-11 Enterprise 10000 System 333-Mhz Processor Upgrade
Instructions
MANUAL: 802-5031-11 Ultra Enterprise CPU Installation Guide
DOC: 805-0323-10 Ultra 3000/4000 Module Installation
MANUAL: 805-1150-10 4Mbyte UltraSPARC II Installation Guide
DOC: 805-2634-10 Torque Screwdriver for UltraSPARC Module Installation
MANUAL: 805-2917-14 Sun Enterprise 10000 System Service Guide
MANUAL: 802-6051-11 Ultra Enterprise 3000 System Manual
MANUAL: 802-3845-11 Ultra Enterprise 4000/5000/6000 System Manual
MANUAL: 805-2630-10 Enterprise 3500 System Reference Manual
MANUAL: 805-2632-10 Enterprise 4500/5500/6500 System Reference Manual
MANUAL: 802-6051-10 Ultra Enterprise 3000 System Manual
MANUAL: 800-4006-XX FE Handbook Vol I
MANUAL: 800-4247-XX FE Handbook Vol II
(* See COMMENTS point 2. at the bottom of the FIN)
References:
MANUAL: 805-4500-11 Enterprise 10000 System 333-Mhz Processor Upgrade
Instructions
MANUAL: 802-5031-11 Ultra Enterprise CPU Installation Guide
DOC: 805-0323-10 Ultra 3000/4000 Module Installation
MANUAL: 805-1150-10 4Mbyte UltraSPARC II Installation Guide
DOC: 805-2634-10 Torque Screwdriver for UltraSPARC Module Installation
MANUAL: 805-2917-14 Sun Enterprise 10000 System Service Guide
MANUAL: 802-6051-11 Ultra Enterprise 3000 System Manual
MANUAL: 802-3845-11 Ultra Enterprise 4000/5000/6000 System Manual
MANUAL: 805-2630-10 Enterprise 3500 System Reference Manual
MANUAL: 805-2632-10 Enterprise 4500/5500/6500 System Reference Manual
MANUAL: 802-6051-10 Ultra Enterprise 3000 System Manual
MANUAL: 800-4006-XX FE Handbook Vol I
MANUAL: 800-4247-XX FE Handbook Vol II
(* See COMMENTS point 2. at the bottom of the FIN)
Issue Description:
Failure to handle EXX00 and E10000 CPU Modules correctly can result in
physical damage. Such damage may result in immediate failure or inter-
mittent failures.
The Augat connectors have a greater chance of damage if proper torquing
techniques are not followed.
The new torque sequence (below) spreads the torque stress across the
Augat connector. This applies when adding or replacing CPU Modules
on ALL enterprise servers (EXX00 and E10000) and the I/O mezzanines of
an Enterprise 10000 Server.
The torque sequence for the E10000 server has not changed as was given
in FIN I0403-1. This FIN has been updated to add the Module Handling procedure
and in addition expand the coverage of the Torque Sequence to the Enterprise
Server EXX00 line (for example E3000, E3500...etc.) and the E10000 Memory
Mezzanine. In addition, this FIN provides the MOST CURRENT procedure that
supersedes procedures listed in the given Documentation References above.
NOTE: New systems from the factory do not require retorquing of hardware
as it is unnecessary and adds the risk of damage.
Implementation:
---
| | MANDATORY (Fully Pro-Active)
---
---
| | CONTROLLED PRO-ACTIVE (Per Sun Geo Plan)
---
---
| x | REACTIVE (As Required)
---
Corrective Action:
This UPDATED FIN has been released with the intent to issue the following
recommendations in such instances when adding or replacing the CPU Modules
of ANY Enterprise Server (EXX00 or E10000) and/or the I/O mezzanines of
an Enterprise 10000 Server, as shown below:
EXX00/E10000 CPU Module / E10k Mezzanine Handling and Torque Procedure:
1. Before handling the CPU module, refer to "The Ultra Enterprise
CPU Installation Guide" p/n 802-5031-xx.
Precautions:
(a) Observe all standard ESD preventative measures when handling
CPU modules, including use of wrist strap or heel strap, proper
grounding of work surface, use of anti-static bags, etc.
(b) DO NOT handle the CPU module by the SRAM Heat sinks or by
the BDB heat sinks.
(c) ONLY handle the CPU module by the CPU heat sink or board edges.
(d) DO NOT touch the Augat connectors.
(e) Turn the CPU module upside down when laying it on the padded mat.
This is to avoid connector contamination and damage.
(f) Handle E10k Memory Mezzanine modules by the circuit board edges
only, do not use the capacitor located in the center of the
module to manipulate the module.
2. If applicable remove the blue plastic protective tape from the
white thermal pad and discard.
3. Blow off all dust particles on the top side of the gold pads
with compressed air or brush provided.
DO NOT use IPA or any other solvent to clean the pads.
4. Place the CPU module at the appropriate location. Ensure that the
CPU module is inserted completely into the PEM standoff.
5. Align the screws against the corresponding holes on the back plate.
6. Tighten the screws is a three step process.
a. Tighten each screw in the sequence listed below until it reaches
the metal plate.
b. Tighten each screw in the sequence listed below an additional
1/2 turn.
c. Torque each screw in the sequence listed below to the 6 in/lb
requirement.
7. Do one CPU module to it's final stage before move on to the next.
Torque Sequences:
The recommended tightening pattern for the (EXX00/E10000) Enterprise Server
Processor Modules has been changed to as follows:
CPU Module new sequence:
_______________
| | |
| | (3) |
| | |
| | |
| | |
| | (4) |
| | |
| +-----|
| |
| |
| |
| |
|_______________|
| |
| (2) (5) (1) |
|_______________|
The tightening pattern for the E10000 I/O mezzanine has been changed
to as follows:
E10000 I/O mezzanine (PCI and SBus) new sequence:
_______________
| | ^
| (1) (5) (3) | ^ ^
|_______________| | Top of System Board
| | |
| | |
| | |
| |
| |
| |
| |
| |
|_______________|
| |
| (2) (6) (4) |
|_______________|
The tightening pattern for the E10000 Memory mezzanine is as
follows (no change to previously documented sequence):
E10000 Memory mezzanine sequence:
__________________________________________________________
| | | |
| | (7) (3) | |
| |_____________| |
|_____ _____ _____ |
| | | | | | |
| (1) | | (6) | | (9) | |
| | | | | | |
| | | | | | |
| (5) | | (2) | | (10)| |
|_____| |_____| |_____| |
| _____________ |
| | | |
| | (4) (8) | |
|_______|_____________|____________________________________|
Comments:
1. Torque Drivers:
Each Enterprise Server ships with a Calibrated Torque Driver. To maintain
calibration integrity the torque driver is to remain with the server.
Replace torque drivers that have been heavily used or whose condition or
calibration is in question.
2. Manual References:
This FIN may reference manuals that describe the "old" CPU Module
torque sequence. The intent of the above mentioned information is
to enforce the recommended CPU Module handling procedure and the
"new" combined EXX00/E10000 CPU Module / torque procedure and
E10000 Memory Mezzanine sequence as described in this FIN. Efforts
are being made to update the manuals having the old torque sequence.
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Implementation Footnote:
________________________
i) In case of MANDATORY FINs, Enterprise Services will attempt to
contact all affected customers to recommend implementation of the FIN.
ii) For CONTROLLED PROACTIVE FINs, Enterprise Services mission critical
support teams will recommend implementation of the FIN (to their
respective accounts), at the convenience of the customer.
iii) For REACTIVE FINs, Enterprise Services will implement the FIN as
the need arises.
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All released FINs and FCOs can be accessed using your favorite network
browser as follows:
SunWeb Access:
______________
* Access the top level URL of http://cte.corp/FIN_FCO/
* From there, select the appropriate link to query or browse the FIN and
FCO Homepage collections.
SunSolve Online Access:
_______________________
* Access the SunSolve Online URL at http://sunsolve.Corp/
* From there, select the appropriate link to browse the FIN or FCO index.
Supporting Documents:
____________________
Supporting documents for FIN/FCOs can be found on Edist. Edist can be
accessed internally at the following URL: http://edist.corp/.
* From there, follow the hyperlink path of "SunService Documentation" and
click on "FIN & FCO attachments", then choose the appropriate folder,
FIN or FCO. This will display supporting directories/files for FINs or
FCOs.
Internet Access:
_______________
* Access the top level URL of https://infoserver.Sun.COM
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General:
________
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