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        - Sun Proprietary/Confidential: Internal Use Only -
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                        FIELD INFORMATION NOTICE
                  (For Authorized Distribution by SunService)

FIN #: I0338-3

Create Date: May/21/98

Keywords: 

UPDATED FIN. E10000 System Board Handling and Cleaning Procedure.

Product Category: Sever / System Board

Product Affected: 

Mkt_ID    Platform   Model     Description               Serial Number
------    --------   -----     -----------               -------------

E10000-X  E10000     E10000-X  Enterprise 10000 Server        -

Parts Affected: 

E10000 system boards with part numbers shown below have NOT had the ECO's
listed under REFERENCES applied.


Part Number             Description              Model
-----------             -----------              -----

F501-4347-08		E10000 System Board       -
F501-4347-09            E10000 System Board       -
F501-4786-01            E10000 System Board       -


*The following part numbers contain the new style fastening hardware:

Part Number		Description
--------------		-----------
F501-4786-01		E10000 System Board with hardware ECO's.
F501-4903-01		E10000 'Latest' System Board Revision.

References: 

Esc: 514041  E10000 system board has metal filings.
ECO: C97025  Changes implemented in system board hardware.
FIN: I0338-2 UPDATED FIN. Cleaning procedure for adding processors, memory  
             mezzanine or I/O mezzanines to a UE10000 system board.

Issue Description: 

Concern has been raised over the existence of small metal particles on Enter-
prise 10000 system boards.  This debris is considered to have NO impact upon
the normal operation of the system boards,  however FIN# I0338-2 details  
acceptable system board handling and system board inspection procedures to 
ensure that the possibility of metal particles causing a hardware fault is  
reduced.

Metal particles can be introduced during the process of removing system board
covers during normal FRU replacement procedures.  The use of power and even 
hand driven tools in removing cover fasteners has been demonstrated to leave 
behind such residue originating from the machined male screw threads, as well 
as from the tapped female screw wells.  Additionally, the cross threading of
screws during insertion has also been identified as a source of metal debris.

Several Engineering Change Orders have already been implemented on the system
board architecture that reduce the possibility of such contaminates.  These
FCOs address the type of material used in the screws, reduce the number of
fasteners on the system board covers and the replacement of tapped screw wells 
with floating PEM fasteners.

Changes to the system board covers ensure that any debris falling from the 
removal or insertion of a screw falls OUTSIDE of the logic area on the module. 
 
The use of stainless steel screws replacing the original zinc screws reduces
the quantity of metallic 'dust' on system boards.

The implementation of floating PEMS greatly reduces the possibility of metal 
filings from tapped screw wells falling onto the board.

Corrective Action: 

In addition to the above mentioned changes which have been implemented on 
E10000 system board assemblies, several steps can be taken by field service   
personnel to reduce the possibility of hardware faults due to such debris  
when handling E10000 system boards.


This UPDATED FIN address the inspection and cleaning of new system boards on 
site during upgrades or system board replacement prior to installing memory  
or I/O mezzanines and CPU modules. FIN I0338-2 details proper cleaning of   
Augat connectors during FRU replacement.  The recommended procedures in BOTH 
FINS should be implemented immediately.


INSPECTION AND CLEANING PROCESS


1. Select a work space in well lighted area.  Ensure that ESD mats are used  
   and that proper ESD grounding is maintained throughout the inspection
   process.

a. Suggested tools to have on hand are:

	o #1 Phillips screw driver
	o flash light or high intensity lamp
	o small tweezers
	o acid-swabbing brush (such as those delivered with I/O cards)
	o can of static-free compressed air
	o DRY, nonabrasive, lint-free laboratory wipes
	o ESD mat and grounding straps/arm bands

2. Remove the FRU side cover of the system board. Place board flat on ESD
   mat with FRU side facing upwards.  Carefully examine the board for
   debris.  Any debris large enough to be noticed should be removed at this
   time with the use of tweezers or a brush. 

3. Smaller debris particles may be removed using the brush, cloth or  
   compressed air by standing the system board on it's top edge (with HANDLE 
   DOWN) in order to avoid having debris fall and attach itself to the CPU 
   module foam heat sink tape.

4. The use of powered tools during FRU replacement or system board cover
   removal and installation is discouraged.  Special attention must be given
   to avoid cross threading of screws during insertion.


*Note: Standard torquing procedures for CPU, I/O and memory mezzanines must
       be followed.  When retorquing a part, remember to LOOSEN or back out 
       the screw BEFORE retightening it.  This will assure the proper torque  
       is applied and will also reduce the chances of breaking a screw.

Comments: 

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